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Microscopic analysis test room
 

Functional introduction
    The microscopic analysis test room mainly carries out the microscopic structure analysis and research of materials, especially the research on change rules of texture, structure and precipitated phase of materials in the high-temperature and long-time service process. These rules play an important role in the damage analysis and life evaluation on power station materials. The test room looks for the causes of accident occurrence or material failure by means of fracture or material damage analysis on failed components. It indicates a direction for improving and upgrading the performance of materials by means of the analysis on texture, structure and precipitated phase of materials.
Instruments and equipment
    Optical metallographic microscope
    Super-depth-of-field three-dimensional microscope system (stereomicroscope)
    Scanning transmission electron microscope
    Transmission electron microscope

Parameters and technical level
    Name and model number of equipment: VEGA 3 XMU scanning electron microscope (equipped with EDS, EBSD and original position tensile and compressive holder for ≤600℃) 
    Magnification factor: 1.5-1,000,000 times
    Resolution: High-vacuum secondary electron: 3.0nm (30kV)
    High-vacuum secondary electron: 8.0nm (3kV)
    Backscattered electron: 3.5nm (30kV)
    Internal dimensions of sample chamber: ≥285mm (Width) X 340mm (Depth) X 320mm (Height)
    Maximum dimensions of loaded sample: φ280mm X 145mm 
    Name and model number of equipment: JEM-2100 transmission electron microscope (equipped with EDS, STEM and original position heating holder for ≤1300℃)
    Magnification factor: 2000-1,500,000 times
    Resolution: Point resolution: 0.23nm
    Linear resolution: 0.14nm
    Beam spot (diameter): TEM mode: 20-200nm
    EDS mode: 1.0-25nm
    Length of camera: Selected-area diffraction: 80-2000mm
Allowable test and inspection items:
    The microstructure observation of various metallic conductive materials can be carried out. Secondary electron images and backscattered electron images can be shot. The real-time micro-area composition analysis on materials, elementary quantitative and qualitative composition analysis, rapid multiple-element point, line and plane distribution measurement, phase identification of crystal/crystal grain, grain size and shape analysis, crystal and crystal grain orientation measurement , etc. can be carried out.

 

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